منحة دكتوراه في الصين

 

City: Shanghai, China
Tuition fees: from 0 yuan/year to 24,600 yuan/year
Application Fee: 1,000 yuan
Service fee: 4,800 yuan

Basic information
  • field : geometry

  • Program name: Design and manufacture of S machines

  • Degree: Bachelor's degree for 4 years

  • Entry date: Autumn 2026

  • Application deadline: March 31, 2026

  • Scholarship Type: Category D

  • Scholarship Duration: One year

  • Scholarship Policy:

    1. Original tuition fees: 16,800 yuan/year

    2. Fees after the scholarship: 8,000 yuan/year

  • age : From 18 to 25 years old

  • Admission for students who have previously studied in China: yes

  • Admission to minors: no

  • The current student's residence: Unlimited (any country)

  • International exceptions: Students are not accepted by:

    • Pakistan, Madagascar, Malawi, Morocco, Niger, Nigeria, Sudan, Tanzania, Botswana, Burkina Faso, Equatorial Guinea, Congo, Guinea, Gabon, Gabon, Zimbabwe, Comoros, Comoros, Côte d'Ivoire, Democratic Republic of the Congo

  • Grading Requirements:

    • Average in Mathematics and English at least 75%

    • For Mongolian Students: At least 85%

  • Passport-size photo

  • Passport data page

  • Academic Grades Reveal (Scanned Color Version)

  • Highest Certificate (Scanned Color Copy)

  • Medical examination form for foreigners

  • Criminal State News (Scanned Color Copy)

  • Bank account statement

  • Application form

  • Residence permit (For China applicants, a valid visa or residence permit)

  • Study certificate in China (if any, with grades list)

  • Other documents as needed

University fees

  • Original Tuition Fees: 16,800 yuan/year

  • Housing Fee - Double Room: 7,000 Yuan/Year

  • Fees after the scholarship: 8,000 yuan/year

  • After-school housing fees: 4,000 yuan/year (double room)

Agent Fee (EduPRchina)

  • Submission Fee (Not Refundable): 500 RM

  • Service Fee: Depending on the agent's level

  1. There are no registration fees.

  2. Housing fee: 4,000 yuan/year (double room).

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